Technological Advancements in Antenna Packaging for Next-Generation Telecommunication

The telecommunications industry is currently undergoing a significant and transformative change in frequency spectrum due to the introduction of high-speed data transmission and low latency through millimeter-wave (mmWave) technology. This transition has created a demand for substantial technological advancements in antenna packaging for devices, which includes RF and optical components, low-loss materials, and advanced semiconductor packaging technologies. IDTechEx has recently published a new report, titled “Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets”, which emphasizes the essential role of packaging in these advancements.

Antenna-in-package (AiP) technology capitalizes on the short wavelengths of mmWave applications to develop smaller antennas that are directly integrated into semiconductor packages. This integration provides benefits such as improved antenna performance and reduced package footprints. Ongoing research is focused on integrating antennas directly onto RF components in the sub-THz range, but it is met with challenges in manufacturing and scalability.

In the development of AiP technology, crucial design considerations include cost-effectiveness, miniaturization, high performance, reliability, and scalability. IDTechEx’s report “Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets” explores these requirements and addresses various aspects, including the selection of antenna elements, substrate technology, substrate materials, integration of passive devices, and supply chain maturity.

The report delves into AiP technologies tailored for 5G mmWave and emerging 6G networks, analyzing substrate technologies such as organic, LTCC, and glass, in addition to packaging methods like flip-chip and fan-out. Furthermore, it explores antenna integration beyond 100 GHz, providing case studies and addressing prevalent challenges in the field of advanced semiconductor packaging solutions.

IDTechEx’s report also includes a 10-year detailed market forecast of 5G infrastructure and consumer devices. It covers forecasts for 5G mmWave base stations, AiP module shipments in mmWave compatible smartphones, and AiP module shipment forecasts by packaging technology for both 5G infrastructure and consumer devices.

In addition to the report, IDTechEx is hosting a free-to-attend webinar on the topic of antenna packaging technologies: “Exploring Antenna Packaging Technologies: From 5G mmWave to 6G”, presented by Dr. Yu-Han Chang, Senior Technology Analyst at IDTechEx. The webinar will provide an overview of antenna packaging technologies for high-frequency telecommunication, the current status of 5G mmWave, the technology roadmap, case studies, market outlook, and the development roadmap for 6G.

For more information about the report and the upcoming webinar, please visit www.IDTechEx.com/AiP and register for the webinar to gain valuable insights into the advancements in antenna packaging technologies for next-generation telecommunication.

Contact Information:
Lucy Rogers
Sales and Marketing Administrator
[email protected]
+44(0)1223 812300