The competition to develop 2-nanometer chips is intensifying as key players in the industry prepare for mass production in the upcoming years. A recent report by ChinaTimes News has disclosed that TSMC’s Fab20 P1 plant in Hsinchu’s Baoshan area will soon undergo equipment installation engineering in anticipation of mass production of the GAA (gate-all-around) architecture. This strategic move is anticipated to attract major tech companies such as Apple, NVIDIA, AMD, and Qualcomm to vie for production capacity.
As reported by industry sources, TSMC is poised to expedite its entry into the 2-nanometer territory, with mass production slated to commence in 2025. This ambitious initiative not only poses a significant challenge to competitors like Samsung and Intel, but also solidifies TSMC’s standing as a trailblazer in advanced chip manufacturing.
The 2-nanometer node marks a noteworthy advancement in chip manufacturing processes, offering enhanced performance and reduced power consumption. TSMC’s adoption of Nanosheet technology structure and backside power rail technology is expected to establish a new benchmark in the industry. Consequently, the company anticipates that the 2-nanometer node will enable it to sustain its technological leadership and capitalize on growth prospects in AI.
Nevertheless, the path to 2-nanometer production presents formidable challenges. The escalating costs of producing 2-nanometer chips have raised concerns, with industry sources forecasting a 50% cost increase compared to the 3-nanometer node. The per-wafer cost is projected to soar to a staggering USD 30,000, posing a significant financial investment for companies. Despite this, market speculations indicate that Apple is likely to be an early adopter of the 2-nanometer technology, leveraging it to enhance chip performance and reduce power consumption in its future products.
The intricacies involved in designing chips for the 2-nanometer node necessitate early collaboration with TSMC in the development process. Several major clients, including MediaTek, Qualcomm, AMD, and NVIDIA, have reportedly initiated collaboration with TSMC in preparation for the forthcoming production phase.
The competition in the development of 2-nanometer technology extends beyond TSMC. ASML, a prominent supplier of photolithography systems, intends to manufacture 10 2-nanometer EUV lithography machines this year, with Intel already reserving six of them. Furthermore, Japan has also joined the race with the establishment of Rapidus Semiconductor Manufacturing, aiming to compete in the 2-nanometer process.
In conclusion, the journey towards 2-nanometer production is rife with challenges and competition as companies strive to assert their dominance in advanced chip technology. With TSMC’s ambitious plans for mass production in 2025, the industry is poised to witness a revolution in chip performance and energy efficiency, heralding a new era in technological innovation.