The persistent endeavours to hinder China’s acquisition of cutting-edge semiconductor technology are ongoing, with the U.S. government contemplating the imposition of further limitations on China’s access to advanced semiconductor technology. According to sources with knowledge of the matter, the Biden administration is looking into curtailing China’s access to gate-all-around (GAA) transistor technology, which is integral to the production of state-of-the-art chips. Additionally, the administration is also considering restrictions on high-bandwidth memory (HBM), which plays a critical role in AI accelerators.
GAA nanosheet transistors offer enhanced density and provide power and performance advantages, rendering them highly desirable. However, this technology is currently only utilized in the most cutting-edge process nodes. While Samsung has already integrated this technology into its 3nm node, Intel and TSMC are also preparing to incorporate GAA into their future nodes. The existing sanctions prohibit China from obtaining the necessary equipment for production at 3nm and below. Nevertheless, there are apprehensions that China may find alternative methods to leverage GAA technology with its existing chipmaking tools, potentially enhancing the performance of its current process nodes.
A Huawei executive has advocated for China to concentrate on maximising the potential of its existing 7nm process node, as the procurement of chipmaking equipment for 3.5nm or smaller chips may not be feasible in the near future. This standpoint, along with the potential for China to implement GAA technology with existing equipment, has prompted the U.S. government to explore the possibility of imposing additional sanctions on China.
Although GAA technology is already subject to restrictions, the White House has not formally announced any heightened limitations. Discussions on this matter have been kept private, and officials have not disclosed a timeline for a final decision. The specifics of the potential restrictions are still being deliberated, as policymakers aim to make it more challenging for China to develop and manufacture the sophisticated computing systems essential for AI models. It is also reported that discussions on new restrictions for HBM exports are ongoing, although they are not as advanced as the proposed GAA restrictions.
As the strategic maneuvering to restrict China’s access to advanced semiconductor technology continues, the impact of these potential restrictions on the global tech industry remains to be seen. Undoubtedly, the ongoing developments in this area are shaping the future landscape of semiconductor technology and international trade relations.