The automotive industry has seen significant advances in electronics, spanning from intelligent infotainment systems to cutting-edge autonomous driving technologies in electric vehicles. Original Equipment Manufacturers (OEMs) are increasingly relying on innovative electronics to enhance vehicle performance, safety, and user experience.
Infineon’s TRAVEO T2G family of automotive microcontrollers (MCUs) has introduced a new graphics engine that markedly improves graphics performance, while simultaneously reducing costs and simplifying integration. These MCUs are specifically designed for application in infotainment and cockpit systems in automobiles, motorcycles, as well as in off-highway mobility, industrial, and medical sectors. The graphics engine minimises the memory needed for graphics processing, resulting in reduced power consumption and costs.
Toshiba has revealed two automotive-grade 40V N-channel power MOSFETs featuring a new small transistor outline gull-wing leads (S-TOGL) package. This new packaging is well-suited for automotive applications with spatial constraints and facilitates efficient heat dissipation, which is critical for automotive operations where MOSFETs may generate heat during high-current activities.
NXP Semiconductors has launched the AW693, an automotive-qualified wireless connectivity solution that allows for dual Wi-Fi 6E and Bluetooth 5.3 connections with integrated security features. This technology supports connectivity across a variety of automotive platforms and is vital for over-the-air updates, enabling OEMs to deliver new features and security updates without requiring alterations to hardware or software.
These innovations are transforming automotive electronics, opening the door to improved human-machine interaction, power systems, and interconnectivity within the automotive industry. With the introduction of these advanced chips, the future of smart automotive design appears more promising than ever.
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